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Center Innovation Fund: JPL CIF

Extreme Imaging

Completed Technology Project

Project Introduction

Extreme Imaging
Sandia will provide, at no cost to JPL, detector wafers that have been bonded to custom CMOS ROICs. JPL will use MBE and ALD to create nanoengineered surfaces that improve sensitivity and stabilize/isolate the detectors against radiation-induced surface damage. This program will produce superlattice-doped photodiodes and imaging arrays for integration and test in Sandia's Z-pinch facility. More »

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