Skip Navigation
Center Innovation Fund: JPL CIF

Extreme Imaging

Completed Technology Project

Project Introduction

Extreme Imaging
Sandia will provide, at no cost to JPL, detector wafers that have been bonded to custom CMOS ROICs. JPL will use MBE and ALD to create nanoengineered surfaces that improve sensitivity and stabilize/isolate the detectors against radiation-induced surface damage. This program will produce superlattice-doped photodiodes and imaging arrays for integration and test in Sandia's Z-pinch facility. More »

Anticipated Benefits

Primary U.S. Work Locations and Key Partners

Project Library

Share this Project

Organizational Responsibility

Project Management

Project Duration

Technology Maturity (TRL)

Technology Areas

Target Destination

Light bulb

Suggest an Edit

Recommend changes and additions to this project record.