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Small Business Innovation Research/Small Business Tech Transfer

Inverted 3J Tandem Thermophotovoltaic Modules

Completed Technology Project

Project Description

Inverted 3J Tandem Thermophotovoltaic Modules
Spire Semiconductor proposes to make an InGaAs-based three-junction (3J) tandem thermophotovoltaic (TPV) cell to utilize more of the blackbody spectrum (from a GPHS) efficiently. Semi-insulating InP wafers will be used for monolithically integrated module (MIM)compatibility and to achieve low free-carrier absorption. In Phase 1, we will design, epitaxially grow, and process large area single junction test cells for each of the three bandgaps proposed (to evaluate material quality), as well as for a full tandem cell structure. In Phase 2, we would further refine the structure and incorporate the material into MIM modules. More »

Anticipated Benefits

Primary U.S. Work Locations and Key Partners

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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.