The proposed effort will make a dramatic improvement in a) size, weight and power based on a transformative approach to manufacturer 3D electronics as well as 2) ease of integration by exploiting standards efforts in the Space community and specifically CubeSat. The most significant contribution we will make is in next generation packaging through the use of Additive Manufacturing of Structural Electronics. The concept of "Plug and Play" implies simple and compatible, but it also implies traditional modular packaging for a specific form factor. By eliminating solder, wire bonds, connector, excess silicon and excess substrate, the possibility exists to shrink an electronic system by more than 100 times. This 100 fold shrinkage will apply to both size and weight and the newly available volume could be applied to power generation and storage. By extending the plug and play concept to "3D Print and Play" -- in which entire satellites will be fabricated layer-by-layer into a monolithic, intelligent, conformal structure. Consequently, the development time is radically reduced, not from "months to days" but rather "days to hours," by automating the manufacturing component of development.