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Small Business Innovation Research/Small Business Tech Transfer

Wide Temperature Cycling Tolerant Electronic Packaging Substrates

Completed Technology Project

Project Description

Wide Temperature Cycling Tolerant Electronic Packaging Substrates
Planetary exploration missions require electronics packaging that can withstand extreme temperatures and numerous temperature cycles (-230C to +350C). The present project proposes a novel metallized ceramic substrates that could potentially withstand these temperature extremes and serve as reliable packaging platforms. Phase I research will be aimed at confirming this - new metallized ceramic substrates will be subjected to severe thermal cycling tests and any change in metallization adhesion to ceramic or change in electrical properties will be quantified. If Phase I is successful, we will proceed to addressing the other important issues, like etching, plating, wire bonding and die bonding to new substrates to result in a demonstrator package capable of withstanding the extreme thermal cycling. More »

Anticipated Benefits

Primary U.S. Work Locations and Key Partners

Technology Transitions

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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.