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Small Business Innovation Research/Small Business Tech Transfer

Wide Temperature Cycling Tolerant Electronic Packaging Substrates, Phase I

Completed Technology Project

Project Introduction

Wide Temperature Cycling Tolerant Electronic Packaging Substrates, Phase I
Planetary exploration missions require electronics packaging that can withstand extreme temperatures and numerous temperature cycles (-230C to +350C). The present project proposes a novel metallized ceramic substrates that could potentially withstand these temperature extremes and serve as reliable packaging platforms. Phase I research will be aimed at confirming this - new metallized ceramic substrates will be subjected to severe thermal cycling tests and any change in metallization adhesion to ceramic or change in electrical properties will be quantified. If Phase I is successful, we will proceed to addressing the other important issues, like etching, plating, wire bonding and die bonding to new substrates to result in a demonstrator package capable of withstanding the extreme thermal cycling. More »

Anticipated Benefits

Primary U.S. Work Locations and Key Partners

Technology Transitions

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Project Duration

Technology Maturity (TRL)

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Target Destination

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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.