NASA applications include compact, dense electronic circuit assemblies, stacked 3D circuits, stacked 3D focal plane assemblies, IC chip integration, wafer-level redistribution (interposer), integrated smart packages.
Electronic and optical packaging is at the heart of every electro-optical system application. It interconnects the individual components, protects the electronic systems against vibration and moisture, and dissipates heat reliably. In short, it ensures that electronics continue to function reliably in even the harshest conditions. Clever packaging also reduces the manufacturing costs for complex electronic systems. Based on that, the proposed innovation allows prototyping, small volume, and scaled production of customized 3D systems for industrial applications like medical, automotive, and communications.