Small Business Innovation Research/Small Business Tech Transfer

An Additive Manufacturing Technique for the Production of Electronic Circuits

Completed Technology Project
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Project Description

The proposed 9-month research project aims for the development of additive manufacturing techniques for the creation of electronic devices. It will develop an innovative additive manufacturing technique that combines the ink-based printing with laser melting technology to directly print a three-dimensional (3D) system with built-in electrical properties and functioning as an electronic device. The fundamental electronic device includes the resistor, conductor, semiconductor, insulator and capacitor. This proposed 3D printing technique involves (1) the development of five fundamental ink-based printing materials suitable for conductor, resistor, capacitor, semiconductor and insulator production; (2) the design of the five rotating injectors for five distinct ink-based materials; (3) the development of laser melting technology to provide on-demand melting and solidification of the dispensed ink-based materials; and (4) the evaluation of 3D printing control software.

Anticipated Benefits

This proposed work will provide key elements required by the direct 3D printing of electronic devices. It potentially enables NASA the technology for advanced manufacturing process to produce electronics in space. It could result in a commercial 3D printing semiconductor materials that is crucial for in-situ resource generation of printed electronics for in-space advanced manufacturing and repair. - In-situ production of functional electronic/electromechanical devices on demand. - In space advanced manufacturing and repair, including printed electronics. - Influence and benefit human related systems or facilities operated temporarily or permanently in space. - New design techniques and software.

- Direct printing of mechanical systems with build in electronic properties. - Robotics and active mechanics. - Direct printing of various sensors. - New software (CAD) tools integrating functional electronic design with mechanical system design. - New multidisciplinary educational tools. Impact on the creation of new types of engineers.

Organizational Responsibility

Project Duration

Start: 2016-06-10
End: 2017-06-09

Partner Organizations

Project Contacts

Primary U.S. Work Locations

Technology Area

Primary Technology Area:

Materials, Structures, Mechanical Systems, and Manufacturing/

12.4 Manufacturing/

12.4.3 Electronics and Optics Manufacturing Processes

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Applied ResearchDevelopmentDemo & Test

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Target Destinations

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