The CRISSP technology suite has multiple NASA applications which will enhance capabilities on the ISS and other long duration missions. The 3D printed packaging architecture can better attenuate launch vibrations than the foam materials already used, its frequency attenuation can be tuned for certain payloads, and it could better protect sensitive experiments from the overall launch vibration as well as from any specific harmful frequencies. After launch, the packaging can be recycled on-board to create 3D printer filament to enable sustainable in-space manufacturing of tools and satellite components.
The underlying technologies used in the CRISSP system have application outside the agency with other non-NASA space customers who also launch payloads into space. We will also reach out to DoD customers, such as the Navy, who are similarly limited to resupply during submarine missions. With the increasing number of 3D printer users as well as the increase in the shipping of goods to residential addresses, there is a lot of space for the CRISSP technology suite to revolutionize the packaging industry. In addition, the design and concept of CRISSP as it pertains to frequency attenuation is very well suited to frequency dampeners, opening a different use case for commercialization.