Under this SBIR program, Ridgetop will introduce the first low-cost, low-power, and lightweight data monitoring solution for rotorcraft diagnostics. The solution is an integrated MEMS-based sensors fabricated by a MEMS-first CMOS process methodology. The device measures temperature, shock, and vibration from multiple sensors integrated onto a single substrate that also contains submicron-scale CMOS electronics for the associated readout and data storage functions. High-sensitivity MEMS structures will be developed, and associated sense amplifiers that exploit low power transistors biased to operate in the subthreshold regions will be introduced. Further scaling in power is achieved by leveraging ultra-small geometries available in modern processes (e.g., 130 nm minimum feature length and below).