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Small Business Innovation Research/Small Business Tech Transfer

Low Cost Automated Module Assembly for 180 GHz Devices

Completed Technology Project

Project Description

Low Cost Automated Module Assembly for 180 GHz Devices

Despite the obvious advantages of millimeter wave technology, a major barrier to expanded use is high assembly costs due to: need for specialized equipments; need for precision impacts on yields; design technologies for manufacturability; and experienced personnel with demonstrated track records. The challenges of this R&D project are to expand and fully develop the Phase 1 technologies for: Methods to use common manufacturing equipment to achieve the high accuracy die placement required for millimeter wave frequencies (+/- 5 micron accuracy) Automation methods and processes to achieving speed and precision for production of low cost modules Modeling to arrive at cost effective trade-offs for achieving customer specifications with minimum capital investment and labor cost As part of the research, NxGen will conduct a demonstration effort utilizing two existing JPL module designs facilitating the collection statistical data both in terms of yields as well as baseline data for cost estimating.

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Anticipated Benefits

Primary U.S. Work Locations and Key Partners

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