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SBIR/STTR

A Reliable Electronic Package for Space Exploration, Phase II

Completed Technology Project

Project Introduction

A Reliable Electronic Package for Space Exploration, Phase II
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes that were developed in Phase I to assemble the components into a hermetically sealed package will be used to package SiGe operational amplifiers. Process and materials reliability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module packages. More »

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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.

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