Small Business Innovation Research/Small Business Tech Transfer
A Reliable Electronic Package for Space Exploration, Phase II
Project Description
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes that were developed in Phase I to assemble the components into a hermetically sealed package will be used to package SiGe operational amplifiers. Process and materials reliability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module packages.
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Primary U.S. Work Locations and Key Partners
| Organizations Performing Work | Role | Type | Location |
|---|---|---|---|
Langley Research Center
(LaRC)
|
Lead Organization | NASA Center | Hampton, Virginia |
| Sienna Technologies, Inc. | Supporting Organization | Industry | Woodinville, Washington |
Primary U.S. Work Locations
-
Virginia
-
Washington
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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.