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SBIR/STTR

High Thermal Conductivity Functionally Graded Heat Sinks for High Power Packaging, Phase I

Completed Technology Project

Project Introduction

High Thermal Conductivity Functionally Graded Heat Sinks for High Power Packaging, Phase I
This NASA SBIR Phase I program proposes the development of a high thermal conductivity (400 W/mK), low coefficient of thermal expansion (7-10 ppm/?K), and light weight (3-4 g/cm3) functionally graded material (FGM) heat sinks for microelectronic packaging applications. The uniquely defined ?FGM concept? pursued in this project uses a metallic package base that consists of a light metal matrix composite material to provide low thermal expansion and a high thermal conductivity functional core to cool the high power semiconductor die. The thermal performance of the heat sink is doubled by using the high thermal conductivity functional core bonded through the body of the heat sink. More »

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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.

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