Using innovative chip thinning technology married with recently available packaging technology, this effort will produce Mechanically Flexible Multifunctional Active Silicon chips. By thinning pre-fabricated silicon chips down to the order of microns, bonding and encapsulating them in flexible polyimide materials; the resulting crystalline silicon chip can be flexed like a piece of paper where all the components ? the wiring, passives, and active silicon chips ? can be rolled, bent, and folded to virtually any shape and size.A Mechanically Flexible Active Silicon System is the next generation of MCM-D technology. Evolving from Chip-on-Flex to Chip-IN-Flex where the active silicon chips are themselves mechanically flexible, this technology will enable countless space, mobile, sensing, and advanced architecture systems for NASA.