Skip Navigation
Small Business Innovation Research/Small Business Tech Transfer

Mechanically Flexible Active Silicon Chips and Systems, Phase I

Completed Technology Project

Project Description

Mechanically Flexible Active Silicon Chips and Systems, Phase I
Using innovative chip thinning technology married with recently available packaging technology, this effort will produce Mechanically Flexible Multifunctional Active Silicon chips. By thinning pre-fabricated silicon chips down to the order of microns, bonding and encapsulating them in flexible polyimide materials; the resulting crystalline silicon chip can be flexed like a piece of paper where all the components ? the wiring, passives, and active silicon chips ? can be rolled, bent, and folded to virtually any shape and size.A Mechanically Flexible Active Silicon System is the next generation of MCM-D technology. Evolving from Chip-on-Flex to Chip-IN-Flex where the active silicon chips are themselves mechanically flexible, this technology will enable countless space, mobile, sensing, and advanced architecture systems for NASA. More »

Primary U.S. Work Locations and Key Partners

Light bulb

Suggest an Edit

Recommend changes and additions to this project record.

This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.