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Small Business Innovation Research/Small Business Tech Transfer

Low Cost, Vacuum Packaging of GN&C Sensors, Phase I

Completed Technology Project

Project Description

Low Cost, Vacuum Packaging of GN&C Sensors, Phase I
Micro-electro-mechanical System (MEMS)-based gyroscopes, accelerometers and rate sensors are essential to miniaturizing the guidance, navigation and control electronics of satellite systems. Wafer level packaging is the preferred method of sealing MEMS devices to achieve low cost. However, devices are currently housed in expensive hermetic packages. In the case of gyros, high vacuum levels need to be created and maintained to achieve high Q values. Current hybrid hermetic packages are expensive, heavy and bulky. Although there is considerable activity in developing wafer level sealing techniques, there is currently no universal approach to seal MEMS devices at the wafer level. SiWave proposes to develop a universal wafer level sealing technology that: does not require processing of the device wafer, achieves room temperature sealing enabling encapsulation of sensitive devices and provides for an evaporable getter to maintain a high vacuum over the life of the package. SiWave will package a very high accuracy, absolute pressure sensor to demonstrate the concept as well as to quantify the effectiveness of the proposed approach. Once sealed at the wafer level, the device can be singulated and packaged using conventional plastic packaging techniques or housed in a low cost, plastic enclosure depending on the application. More »

Anticipated Benefits

Primary U.S. Work Locations and Key Partners

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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.