Superconducting Vias for High Performance Microwave Applications
Project Introduction
We will develop superconducting vias for use as bridge crossovers with a novel planar sacrificial MEMS (Micro-Electro-Mechanical Systems) process. The resulting circuit structures will be impedance matched and applicable for use below the superconducting gap frequency commonly in use in planar transmission line circuits.
An ultra-broadband air-gap low-parasitic superconducting crossover circuit be optimized, prototyped, and cryogenically evaluated. We will also explore a innovative via-less design concept based on a 4-port symmetric planar junction.
More »Anticipated Benefits
Instrument concepts under exploration for the Inflation Probe, SPICA, and SPECs would benefit from the proposed effort. More generally, end use of this technology has greater applicability and potential to significantly advance reliable routing and signal control in high frequency planar circuitry.
More »Primary U.S. Work Locations and Key Partners
| Organizations Performing Work | Role | Type | Location |
|---|---|---|---|
Goddard Space Flight Center
(GSFC)
|
Lead Organization | NASA Center | Greenbelt, Maryland |
Primary U.S. Work Locations
-
Maryland
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Organizational Responsibility
Responsible Mission Directorate:
- Mission Support Directorate (MSD)
Lead Center / Facility:
- Goddard Space Flight Center (GSFC)
Responsible Program:
- Center Independent Research & Development: GSFC IRAD
Project Management
Program Manager:
Project Manager:
Principal Investigator:
Co-Investigators:
Project Duration
Technology Maturity (TRL)
| Start: | 1 |
| Current: | 2 |
| Estimated End: | 4 |
Technology Areas
Primary:
- TX08 Sensors and Instruments
- TX08.1 Remote Sensing Instruments/Sensors
- TX08.1.1 Detectors and Focal Planes
