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Center Independent Research & Development: GSFC IRAD

Superconducting Vias for High Performance Microwave Applications

Completed Technology Project

Project Introduction

We will develop superconducting vias for use as bridge crossovers with a novel planar sacrificial MEMS (Micro-Electro-Mechanical Systems) process.  The resulting circuit structures will be impedance matched and applicable for use below the superconducting gap frequency commonly in use in planar transmission line circuits.

An ultra-broadband air-gap low-parasitic superconducting crossover circuit be optimized, prototyped, and cryogenically  evaluated. We will also explore a innovative via-less design concept based on a 4-port symmetric planar junction.

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Anticipated Benefits

Primary U.S. Work Locations and Key Partners

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Project Duration

Technology Maturity (TRL)

Technology Areas

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