Integration of a mix of heterogeneous electronic device technologies (silicon, III-V, passive, etc.) into a single multifunctional substrate core. Based on the development and implementation of 2.5D and 3-D interconnect and interposer packaging technologies. Target small sat deep space transponder/RF comms boards into one board for >50% size and weight savings.
A custom multifunctional core substrate scheme comprised of next generation polyimide, ceramic and/or silicon materials will be designed to integrate new 2.5D and 3-D interconnect technologies into producing a significant size and power reduced RF transponder. Development of heterogeneous flip chip attachment to low loss substrates, embedded RF waveguides and passives (R,L,C) and completely plug in/stackable Multichip Modules (MCM) will be required to meet this goal.More »
Substantially reduce the size of RF systems such as radio and communication boards and demonstrate the cost effectiveness of 2.5D packaging technology into low volume production.More »
|Organizations Performing Work||Role||Type||Location|
|Jet Propulsion Laboratory (JPL)||Lead Organization||FFRDC/UARC||Pasadena, California|