3D Photocatalytic Air Processor for Dramatic Reduction of Life Support Mass & Complexity
Project Introduction
The combination of novel photoelectrochemistry and 3-dimensional design allows tremendous mass saving, hardware complexity reduction, increases in deployment flexibility and removal efficiency. The high tortousity photocatalystic air processor design will achieve at least two orders of magnitude mass and power saving respectively, and enable feasibility of compact processors for spacecraft. The proposed work will demonstrate these drastic reduction in reactor mass, volume and power consumption in comparison to current technology with delivery of high-tortuosity device components allowed by 3D printing (potentially in space) at the end of the proposed work.
More »Anticipated Benefits
This technology has the potential to dramatically reduce the cost and risk of CO2 management systems in future extended missions. The High Tortuosity PhotoElectroChemical (HTPEC) system operates in much the same way a tree would function, namely directly contacting the cabin air with a photocatalyst in the presence of light and water (as humidity) to immediately conduct the process of CO2 reduction to O2 and useful, tunable carbon products. This eliminates many of the inefficiencies associated with current ISS CO2 management systems.
More »Primary U.S. Work Locations and Key Partners
| Organizations Performing Work | Role | Type | Location |
|---|---|---|---|
Ames Research Center
(ARC)
|
Lead Organization | NASA Center | Moffett Field, California |
Primary U.S. Work Locations
-
California
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Organizational Responsibility
Responsible Mission Directorate:
- Space Technology Mission Directorate (STMD)
Lead Center / Facility:
- Ames Research Center (ARC)
Responsible Program:
- NASA Innovative Advanced Concepts
Project Management
Program Director:
Program Manager:
Principal Investigator:
Co-Investigators:
- Kenneth C Cheung
- John E Hogan
- Darrell L Jan
Project Duration
Technology Maturity (TRL)
| Start: | 1 |
| Current: | 1 |
| Estimated End: | 1 |
Technology Areas
Primary:
- TX02 Flight Computing and Avionics
- TX02.1 Avionics Component Technologies
- TX02.1.6 Radiation Hardened ASIC Technologies
Target Destination
