This is a crosscutting technology that promises to make it easier and more efficient to remove heat from small spaces, vastly expanding the capabilities of advanced instruments and microprocessors. If engineers can develop technology to carry away more heat, they will be able to use higher-power, more capable components that do generate more heat than less powerful circuitry. This technology, a microscale electrohydrodynamic (EHD)-based thermal control device, addresses the challenge. Principal investigators believe the technology could be used in electronic cards, lab-on-a-chip scientific instruments, quick-response spacecraft, and power electronics in aircraft and automobiles.More »
The principal investigator expects this subsystem to provide thermal stability, improved reliability, and greater processing capacity. It satisfies NASA goals to significantly improve resource efficiency and capability of onboard processing systems, potentially benefiting the xilinx processor, SpaceCube, and such missions as NASA's Laser Communications Relay Demonstration. The principal investigator, who is seeking and has received funding from a number of non-NASA organizations, will continue laying the technical foundation to ultimately enable onboard data-processing thermal-control solutions at the electronic component, chip, board and enclosure level.More »
|Organizations Performing Work||Role||Type||Location|
|Goddard Space Flight Center (GSFC)||Lead Organization||NASA Center||Greenbelt, Maryland|
|Illinois Institute of Technology||Supporting Organization||Academia||Chicago, Illinois|
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