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Center Innovation Fund: JPL CIF

Ultra-Low Power Extreme Environment Capable Avionics System-on-a-Chip Project

Completed Technology Project
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Project Description

Ultra-Low Power Extreme Environment Capable Avionics System-on-a-Chip Project
Develop ultra-low-power, wide-temperature (-150° C to +250 ° C), digital System-on-a-Chip (SOC) ASIC technology in a high resolution, inherently rad-hard IBM Silicon-on-Insulator (SOI) CMOS process to enable next-generation flight electronics. Demonstrate main flight-system electronics (flight processor, high- and low-speed instrument interfaces) in a chip containing a Cortex-M0 microprocessor that has been synthesized using a custom wide-temperature digital logic library developed in the same high resolution IBM SOI CMOS process. More »

Anticipated Benefits

Primary U.S. Work Locations and Key Partners

Technology Transitions

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