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Center Innovation Fund: GSFC CIF

Micro-scale Electrohydrodynamic Thermal and Fluid Management for Advanced On-Board Processing Systems

Completed Technology Project

Project Description

Project Image   ROE FY13 CIF 128 CN Prototype Micro-scale EHD Based Thermal Control
Chip-Integrated, Hybrid EHD/Capillary-Driven Thermal Management System is a two year that will leverage independently attained yet related prototype hardware advances for electronics thermal management into a ground breaking hybrid thermal control system for spacecraft applications. Objectives · Design, fabricate, and validate the chip integrated hybrid EHD/capillary device · Quantify the reduction in required radiator area by utilizing chip integrated thermal management system (TMS) · Fabricate and validate in thermal vacuum environment the Chip Integrated Hybrid EHD/Capillary TMS
 The proposed research will develop novel enabling thermal management technology addressing subsystem (on-board processing and electronics thermal management) as well as spacecraft level design. The proposed validated prototype system would achieve the following engineering advantages:(1) EHD/capillary-driven thermal management system with low mass/volume and power consumption which limits the total power dissipation required of the thermal subsystem; (2) high heat transfer coefficient mechanism using thin film evaporation to maximize the heat rejection temperature and reduce the required radiator area; (3) self-regulating and smart fluid management to permit heat rejection from an arbitrary surface to the lowest available temperature sink. The current state of
 the art for electronics thermal control, wherein thermal control hardware is remotely 
integrated and requires relatively massive, voluminous and power consuming resources
as well as large temperature differences to
 serve as the driving potential transferring
 dissipated heat. These characteristics impede 
the goal of capable, efficient, and
miniaturized on-board processing systems. Furthermore, processing capability is limited by thermal control considerations, such as the amount of heat rejected, the heat flux along the path of heat rejection, and the temperature difference between
 the electronics components and the thermal sink. Thus, technologists seek to integrate the thermal management
 solution directly into the chip layout, substrate structure,
and/or package design. This will substantially
 boost the cooling performance, while introducing
 significant reduction in the package size, and requiring
 much smaller overall system temperature driving potential:
a 3-D integrated solution that is lighter, more compact, and
capable of greater heat transport. In addition, a
 two-phase device would provide thermal uniformity, reducing thermal stresses and thus enhancing overall
component reliability. Functionally, this 
concept will reduce the thermal resistance
 between the chip and the radiator, raising
 the heat rejection temperature with little cost
 in power consumption. The net effect is to 
increase the available temperature for heat rejection, presenting the spacecraft with the advantages of increased power levels and/or reduced radiator mass and volume. The prototype TMS hardware will consist of an integrated heat sink chip embedded hybrid EHD/capillary-driven fluid management device that would ensure liquid supply and system self- regulation at the evaporative surfaces. More »

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