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SBIR/STTR

3D High Density Wave Interconnects, Phase II

Completed Technology Project

Project Introduction

3D High Density Wave Interconnects, Phase II
Nuvotronics has developed and optimized the PolyStrataTM process for the fabrication of intricate microwave and millimeter-wave devices. These devices have primarily been rectangular coaxial transmission lines, although rectangular waveguide and other structures have also been demonstrated. Intricate devices have been demonstrated with insertion loss 5 to 10 times lower than traditional planar circuits; isolation better than 60dB for lines that share separating walls; multiple levels of densely-packed coaxial circuits; and low-parasitic attachment to active devices and traditional circuit boards. In this Phase II project, Nuvotronics will optimize and fabricate high density low-loss millimeter backplane circuits to package and interconnect components of future NASA millimeter wave (MMW) radars. The significance of the innovation primarily lies in three areas: reduction of system size, weight and loss in MMW radars. The PolyStrata technology is a batch manufacturing process, providing economies of scale and cost reduction for higher volumes, in addition to flexibility in design for various frequencies of interest. More »

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