This restart and expansion of the FY17 effort seeks to refine the team's capability to 3D print a variety of sensors, wire connectors, and related devices at micron scale. Pervious efforts demonstrated feasibility, but the techniques still require significant refinement in order to demonstrate repeatability. For FY18 the focus will be on validating the survivability of printed flexible readout strips during assembly and testing, and printing conformal conductive (and superconductive) traces over large-area assemblies and three-dimensional shapes. This effort supports such flight programs as PRAXyS and the Next Generation of X-ray Polarimeter (NGXP). For example, the current SAO for the NGXT detector is at a pitch of 121 micron. This direct write technology should reduce the pitch to 60 micros, thus increasing sensitivity by 3X. The FY18 effort will also investigate printing of Al superconducting inks. A key goal is 3D printing of the sensor assemblies by the end of the FY.