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Center Independent Research & Development: GSFC IRAD

Chemical Mechanical Planarization Technology Enabling for Astrophysics Missions

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Project Introduction

Detector technology for NASA applications is progressing to more complex multilayer circuits to gain advances in array size or detector performance. Chemical Mechanical Planarization (CMP) is a technique that maintains high fabrication yield and increases feature density in multilayer structures. While outside foundries offer CMP for a limited set of materials, we propose to leverage in-house and federal government facilities to develop custom CMP techniques for the specific materials we need, thereby enabling breakthrough enhancements in detectors, multiplexers, and microwave devices for astrophysics missions.

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