Small Business Innovation Research/Small Business Tech Transfer
High Power Wide Bandgap Engineered MMW MMIC Transceiver
Project Description
During this phase I SBIR effort unique proven lattice and bandgap engineering techniques will be utilized to epitaxially grow InAlAs / InGaAs on GaN substrate for the design and fabrication of high power reconfigurable transceiver single MMIC.
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Anticipated Benefits
Satellite communication and automotive radar
High power Solid State Power Amplifiers (SSPA) upto 50W with power combiners. High power X-band through Ka-Band radar / transceiver MMIC More »
High power Solid State Power Amplifiers (SSPA) upto 50W with power combiners. High power X-band through Ka-Band radar / transceiver MMIC More »
Primary U.S. Work Locations and Key Partners
| Organizations Performing Work | Role | Type | Location |
|---|---|---|---|
| TLC Precision Wafer Technology, Inc. | Lead Organization |
Industry
Minority-Owned Business,
Small Disadvantaged Business (SDB)
|
Minneapolis, Minnesota |
| Jet Propulsion Laboratory (JPL) | Supporting Organization | FFRDC/UARC | Pasadena, California |
Primary U.S. Work Locations
-
California
-
Minnesota
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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.