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SBIR/STTR

A Reliable Electronic Package for Space Exploration, Phase I

Completed Technology Project

Project Introduction

A Reliable Electronic Package for Space Exploration, Phase I
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes to assemble the components into a hermetically sealed package will be identified and developed. Process and materials capability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module test vehicle. More »

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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.

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