Small Business Innovation Research/Small Business Tech Transfer
A Reliable Electronic Package for Space Exploration, Phase I
Project Description
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes to assemble the components into a hermetically sealed package will be identified and developed. Process and materials capability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module test vehicle.
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Primary U.S. Work Locations and Key Partners
| Organizations Performing Work | Role | Type | Location |
|---|---|---|---|
Langley Research Center
(LaRC)
|
Lead Organization | NASA Center | Hampton, Virginia |
| Sienna Technologies, Inc. | Supporting Organization | Industry | Woodinville, Washington |
Primary U.S. Work Locations
-
Virginia
-
Washington
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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.