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Miniaturized Thermal-Cooler for IC Applications, Phase I

Completed Technology Project

Project Introduction

Miniaturized Thermal-Cooler for IC Applications, Phase I
This proposal is submitted for research on using MEMS technology to make unique, highly reliable, miniaturized capillary pumped coolers in the application of Thermal Control for Instruments (subtopic: E1.07). The proposed miniaturized thermal-cooler can be fabricated on Si wafer or directly on the back of the IC circuits. The proposed micro-cooler potentially has high mechanical reliability. The proposed micro-cooler has its own coolant supply and needs no extra coolant reservoir and supply. More »

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This is a historic project that was completed before the creation of TechPort on October 1, 2012. Available data has been included. This record may contain less data than currently active projects.