{"projectId":94726,"project":{"projectId":94726,"title":"Radiation-Hardened I/O Expansion Chip","startDate":"2018-07-27","startYear":2018,"startMonth":7,"endDate":"2019-02-15","endYear":2019,"endMonth":2,"programId":73,"program":{"ableToSelect":false,"acronym":"SBIR/STTR","isActive":true,"description":"<p>The NASA SBIR and STTR programs fund the research, development, and demonstration of innovative technologies that fulfill NASA needs as described in the annual Solicitations and have significant potential for successful commercialization. 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This feature is expected to give the system designer good options for system level power saving modes as well as more system fault management capabilities. The I/O Expansion chip will be implemented using VORAGO Technologies proven radiation-hardening HARDSIL® technology. HARDSIL technology will make the I/O Expansion chip immune from latch-up.","benefits":"This device will be an ideal companion part for next generation spaceflight processor devices, including the High-Performance Spaceflight Computing (HPSC) Chiplet. Programming the device and supporting software will be straightforward as it is based on an existing widely used ARM Cortex architecture. Possible applications of the device would be: - I/O Expander for processors or FPGAs, - Multi-communications interface / hub for processors or FPGAs, - Network bridge for processors or FPGAs, - Standalone A5 class processor with multiple communications interfaces, - Redundant processor system for implementing additional system-level lower power modes, - Redundant processor system for implementing failsafe strategy<br /> <br />Based on our experience marketing ARM Cortex-M based microcontrollers to the space market, we have determined that is a demand for a device like the I/O Expander Chip for the types of applications that are stated in section 10.1. 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Specifically, the NASA SBIR/STTR Program has the Phase II Enhancement (Phase II-E) and Phase II eXpanded (Phase II-X) contract options.&nbsp;</p><p><strong>Please review the links below to obtain more information on the SBIR/STTR programs.</strong></p><ul><li><strong><a target=\"_blank\" href=\"http://sbir.gsfc.nasa.gov/sites/default/files/ParticipationGuide.pdf\">Participation Guide</a></strong></li></ul><p>Provides an overview of the SBIR and STTR programs as implemented by NASA</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/solicitations\">Program Solicitations</a></strong></li></ul><p>Provides access to the annual SBIR/STTR Solicitations containing detailed information on the program eligibility requirements, proposal instructions and research topics and subtopics</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/prg_sched_anncmnt\">Schedule and Awards</a></strong></li></ul><p>Schedule and links for the SBIR/STTR solicitations and selection announcements</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/content/additional-sources-assistance\">Sources of Assistance</a></strong></li></ul><p>Federal and non-Federal sources of assistance for small business</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/abstract_archives\">Awarded Abstracts</a></strong></li></ul><p>Search our complete archive of awarded project abstracts to learn about what NASA has funded</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/content/frequently-asked-questions\">Frequently Asked Questions</a></strong></li></ul><p>&nbsp;Still have questions? 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This feature is expected to give the system designer good options for system level power saving modes as well as more system fault management capabilities. The I/O Expansion chip will be implemented using VORAGO Technologies proven radiation-hardening HARDSIL® technology. HARDSIL technology will make the I/O Expansion chip immune from latch-up.","benefits":"This device will be an ideal companion part for next generation spaceflight processor devices, including the High-Performance Spaceflight Computing (HPSC) Chiplet. Programming the device and supporting software will be straightforward as it is based on an existing widely used ARM Cortex architecture. 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This device, implemented in CMOS and radiation-hardened by HARDSIL would be an ideal companion chip to next generation spaceflight processors as well as a cost-effective alternative to solutions such as some expensive FPGAs and SPARC-based products.","releaseStatus":"Released","status":"Completed","destinationType":["Earth"],"trlBegin":2,"trlCurrent":3,"trlEnd":3,"favorited":false,"detailedFunding":false,"programContacts":[],"endDateString":"Feb 2019","startDateString":"Jul 2018"},"relatedProjectId":102321,"relatedProject":{"projectId":102321,"title":"Radiation-Hardened I/O Expansion Chip","startDate":"2019-08-11","startYear":2019,"startMonth":8,"endDate":"2021-01-10","endYear":2021,"endMonth":1,"programId":73,"program":{"ableToSelect":false,"acronym":"SBIR/STTR","isActive":true,"description":"<p>The NASA SBIR and STTR programs fund the research, development, and demonstration of innovative technologies that fulfill NASA needs as described in the annual Solicitations and have significant potential for successful commercialization. If you are a small business concern (SBC) with 500 or fewer employees or a non-profit RI such as a university or a research laboratory with ties to an SBC, then NASA encourages you to learn more about the SBIR and STTR programs as a potential source of seed funding for the development of your innovations.</p><p><strong>The SBIR and STTR programs have 3 phases</strong>:</p><ul><li><strong>Phase I</strong> is the opportunity to establish the scientific, technical, and commercial feasibility of the proposed innovation in fulfillment of NASA needs.</li><li><strong>Phase II</strong> is focused on the development, demonstration and delivery of the proposed innovation.</li></ul><p>The SBIR and STTR Phase I contracts last for 6 months with a maximum funding of $125,000, and Phase II contracts last for 24 months with a maximum funding of $750,000 - $1.5 million.</p><ul><li><strong>Phase III</strong> is the commercialization of innovative technologies, products, and services resulting from either a Phase I or Phase II contract. Phase III contracts are funded from sources other than the SBIR and STTR programs and may be awarded without further competition.</li></ul><p><strong>Opportunity for Continued Technology Development Post-Phase II</strong>:</p><p>The NASA SBIR/STTR Program currently has in place two initiatives for supporting its small business partners past the basic Phase I and Phase II elements of the program that emphasize opportunities for commercialization. Specifically, the NASA SBIR/STTR Program has the Phase II Enhancement (Phase II-E) and Phase II eXpanded (Phase II-X) contract options.&nbsp;</p><p><strong>Please review the links below to obtain more information on the SBIR/STTR programs.</strong></p><ul><li><strong><a target=\"_blank\" href=\"http://sbir.gsfc.nasa.gov/sites/default/files/ParticipationGuide.pdf\">Participation Guide</a></strong></li></ul><p>Provides an overview of the SBIR and STTR programs as implemented by NASA</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/solicitations\">Program Solicitations</a></strong></li></ul><p>Provides access to the annual SBIR/STTR Solicitations containing detailed information on the program eligibility requirements, proposal instructions and research topics and subtopics</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/prg_sched_anncmnt\">Schedule and Awards</a></strong></li></ul><p>Schedule and links for the SBIR/STTR solicitations and selection announcements</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/content/additional-sources-assistance\">Sources of Assistance</a></strong></li></ul><p>Federal and non-Federal sources of assistance for small business</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/abstract_archives\">Awarded Abstracts</a></strong></li></ul><p>Search our complete archive of awarded project abstracts to learn about what NASA has funded</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/content/frequently-asked-questions\">Frequently Asked Questions</a></strong></li></ul><p>&nbsp;Still have questions? Visit the program FAQs</p>","parentProgram":{"ableToSelect":false,"isActive":true,"description":"Catalyst is a portfolio of early stage programs that specialize in different innovation constituencies and mechanisms to push the state of the art in aerospace technology development","programId":92327,"responsibleMd":{"canUserEdit":false,"locationEdit":false,"organizationRolePretty":"","organizationTypePretty":""},"title":"Catalyst","manageGaps":false,"acronymOrTitle":"Catalyst"},"parentProgramId":92327,"programId":73,"responsibleMd":{"organizationId":4875,"organizationName":"Space Technology Mission Directorate","acronym":"STMD","organizationType":"NASA_Mission_Directorate","canUserEdit":false,"locationEdit":false,"organizationRolePretty":"","organizationTypePretty":"NASA Mission Directorate"},"responsibleMdOffice":4875,"stockImageFileId":36648,"title":"Small Business Innovation Research/Small Business Tech Transfer","manageGaps":false,"acronymOrTitle":"SBIR/STTR"},"description":"VORAGO Technologies has produced an IC definition and architecture for a rad-hard I/O Expansion chip that is capable of interfacing to next generation spaceflight processor devices including the High-Performance Spaceflight Computing (HPSC) chiplet. We have gathered the best available knowledge of HPSC use-cases to conceptualize and articulate the requirements for an I/O Expansion Chip, creating an architecture for an optimized and robust IC that can be implemented to meet the requirements of next generation NASA space electronics systems. In addition to providing a perfect companion IC to the HPSC in next generation systems architectures, the I/O Expansion Chip can facilitate the use of the HPSC with legacy systems (such as those that include MIL-STD-1553 communications). Support of legacy systems is a practical requirement for the next decade. The I/O Expansion Chip will allow the HPSC to interface with legacy systems as well as next generation systems. We most recently added USB 3.0 to the definition to support camera interfaces that are being considered / selected for Orion and SPLICE programs at NASA Johnson Space Center. VORAGO Technologies would like to commercialize the I/O Expansion Chip product and target sales to NASA and non-NASA commercial aerospace customers. Making the product commercially successful outside of NASA applications will increase sales volume and establish a more robust supply chain for the product. In phase II, we propose to create a detailed IC specification, acquire the main IP blocks and create a hardware prototype system of the I/O Chip using the Synopsys HAPS80 prototyping system. This approach is consistent with that taken for the HPSC chiplet development process.","benefits":"The I/O Expansion Chip will be suitable for use in spacecraft, and cyber-physical/robotics or autonomous systems in space radiation environments. Everywhere that an HPSC device can be used, it is likely that one or more I/O Expansion Chips can be used. Such applications include: Vision-based algorithms with real-time requirements (e.g. landing with hazard avoidance), Model-based reasoning techniques for autonomy (e.g. Mars rover mission planning), High rate instrument data processing (e.g. high-resolution satellite image processing)<br /> <br />I/O Expansion for processors & FPGAs, Multi-comms interface & hub for processors & FPGAs, Network bridge for processors/FPGAs, Standalone A5 class processor with multiple comms interfaces, Redundant processor system for implementing system-level low power modes, Redundant processor system for implementing failsafe, Interface to cameras on Orion and SPLICE programs that use USB 3.0 camera interface","releaseStatus":"Released","status":"Completed","destinationType":["Earth"],"trlBegin":3,"trlCurrent":4,"trlEnd":4,"favorited":false,"detailedFunding":false,"programContacts":[],"endDateString":"Jan 2021","startDateString":"Aug 2019"},"technologyOutcomePartner":"Other","technologyOutcomeDate":"2018-05-08","technologyOutcomePath":"Advanced_To","infoText":"Advanced within the program","infoTextExtra":"Another project within the program (Radiation-Hardened I/O Expansion Chip)","isIndirect":false,"infusionPretty":"","isBiDirectional":true,"technologyOutcomeDateString":"May 2018","technologyOutcomeDateFullString":"May 2018","technologyOutcomePartnerPretty":"Other","technologyOutcomePathPretty":"Advanced To","technologyOutcomeRationalePretty":""},{"technologyOutcomeId":98267,"projectId":94726,"project":{"projectId":94726,"title":"Radiation-Hardened I/O Expansion Chip","startDate":"2018-07-27","startYear":2018,"startMonth":7,"endDate":"2019-02-15","endYear":2019,"endMonth":2,"programId":73,"program":{"ableToSelect":false,"acronym":"SBIR/STTR","isActive":true,"description":"<p>The NASA SBIR and STTR programs fund the research, development, and demonstration of innovative technologies that fulfill NASA needs as described in the annual Solicitations and have significant potential for successful commercialization. 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This feature is expected to give the system designer good options for system level power saving modes as well as more system fault management capabilities. The I/O Expansion chip will be implemented using VORAGO Technologies proven radiation-hardening HARDSIL® technology. HARDSIL technology will make the I/O Expansion chip immune from latch-up.","benefits":"This device will be an ideal companion part for next generation spaceflight processor devices, including the High-Performance Spaceflight Computing (HPSC) Chiplet. Programming the device and supporting software will be straightforward as it is based on an existing widely used ARM Cortex architecture. Possible applications of the device would be: - I/O Expander for processors or FPGAs, - Multi-communications interface / hub for processors or FPGAs, - Network bridge for processors or FPGAs, - Standalone A5 class processor with multiple communications interfaces, - Redundant processor system for implementing additional system-level lower power modes, - Redundant processor system for implementing failsafe strategy<br /> <br />Based on our experience marketing ARM Cortex-M based microcontrollers to the space market, we have determined that is a demand for a device like the I/O Expander Chip for the types of applications that are stated in section 10.1. This device, implemented in CMOS and radiation-hardened by HARDSIL would be an ideal companion chip to next generation spaceflight processors as well as a cost-effective alternative to solutions such as some expensive FPGAs and SPARC-based products.","releaseStatus":"Released","status":"Completed","destinationType":["Earth"],"trlBegin":2,"trlCurrent":3,"trlEnd":3,"favorited":false,"detailedFunding":false,"programContacts":[],"endDateString":"Feb 2019","startDateString":"Jul 2018"},"technologyOutcomeDate":"2019-02-15","technologyOutcomePath":"Closed_Out","files":[{"title":"Final Summary Chart","file":{"fileExtension":"pdf","fileId":370132,"fileName":"1546628662352","fileSize":804317,"objectId":98267,"objectType":"technologyOutcomeFiles","presignedUpload":false,"fileSizeString":"785.5 KB"},"technologyOutcomeId":98267,"fileId":370132}],"infoText":"Closed out","infoTextExtra":"Project closed out","isIndirect":false,"infusionPretty":"","isBiDirectional":false,"technologyOutcomeDateString":"Feb 2019","technologyOutcomeDateFullString":"February 2019","technologyOutcomePartnerPretty":"","technologyOutcomePathPretty":"Closed Out","technologyOutcomeRationalePretty":""},{"technologyOutcomeId":99557,"projectId":94726,"project":{"projectId":94726,"title":"Radiation-Hardened I/O Expansion Chip","startDate":"2018-07-27","startYear":2018,"startMonth":7,"endDate":"2019-02-15","endYear":2019,"endMonth":2,"programId":73,"program":{"ableToSelect":false,"acronym":"SBIR/STTR","isActive":true,"description":"<p>The NASA SBIR and STTR programs fund the research, development, and demonstration of innovative technologies that fulfill NASA needs as described in the annual Solicitations and have significant potential for successful commercialization. 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Phase III contracts are funded from sources other than the SBIR and STTR programs and may be awarded without further competition.</li></ul><p><strong>Opportunity for Continued Technology Development Post-Phase II</strong>:</p><p>The NASA SBIR/STTR Program currently has in place two initiatives for supporting its small business partners past the basic Phase I and Phase II elements of the program that emphasize opportunities for commercialization. Specifically, the NASA SBIR/STTR Program has the Phase II Enhancement (Phase II-E) and Phase II eXpanded (Phase II-X) contract options.&nbsp;</p><p><strong>Please review the links below to obtain more information on the SBIR/STTR programs.</strong></p><ul><li><strong><a target=\"_blank\" href=\"http://sbir.gsfc.nasa.gov/sites/default/files/ParticipationGuide.pdf\">Participation Guide</a></strong></li></ul><p>Provides an overview of the SBIR and STTR programs as implemented by NASA</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/solicitations\">Program Solicitations</a></strong></li></ul><p>Provides access to the annual SBIR/STTR Solicitations containing detailed information on the program eligibility requirements, proposal instructions and research topics and subtopics</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/prg_sched_anncmnt\">Schedule and Awards</a></strong></li></ul><p>Schedule and links for the SBIR/STTR solicitations and selection announcements</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/content/additional-sources-assistance\">Sources of Assistance</a></strong></li></ul><p>Federal and non-Federal sources of assistance for small business</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/abstract_archives\">Awarded Abstracts</a></strong></li></ul><p>Search our complete archive of awarded project abstracts to learn about what NASA has funded</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/content/frequently-asked-questions\">Frequently Asked Questions</a></strong></li></ul><p>&nbsp;Still have questions? Visit the program FAQs</p>","parentProgram":{"ableToSelect":false,"isActive":true,"description":"Catalyst is a portfolio of early stage programs that specialize in different innovation constituencies and mechanisms to push the state of the art in aerospace technology development","programId":92327,"responsibleMd":{"canUserEdit":false,"locationEdit":false,"organizationRolePretty":"","organizationTypePretty":""},"title":"Catalyst","manageGaps":false,"acronymOrTitle":"Catalyst"},"parentProgramId":92327,"programId":73,"responsibleMd":{"organizationId":4875,"organizationName":"Space Technology Mission Directorate","acronym":"STMD","organizationType":"NASA_Mission_Directorate","canUserEdit":false,"locationEdit":false,"organizationRolePretty":"","organizationTypePretty":"NASA Mission Directorate"},"responsibleMdOffice":4875,"stockImageFileId":36648,"title":"Small Business Innovation Research/Small Business Tech Transfer","manageGaps":false,"acronymOrTitle":"SBIR/STTR"},"description":"VORAGO Technologies will create a rad-hard I/O Expansion Chip for next generation spaceflight processor devices, including the High-Performance Spaceflight Computing (HPSC) Chiplet. 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This feature is expected to give the system designer good options for system level power saving modes as well as more system fault management capabilities. The I/O Expansion chip will be implemented using VORAGO Technologies proven radiation-hardening HARDSIL® technology. HARDSIL technology will make the I/O Expansion chip immune from latch-up.","benefits":"This device will be an ideal companion part for next generation spaceflight processor devices, including the High-Performance Spaceflight Computing (HPSC) Chiplet. Programming the device and supporting software will be straightforward as it is based on an existing widely used ARM Cortex architecture. Possible applications of the device would be: - I/O Expander for processors or FPGAs, - Multi-communications interface / hub for processors or FPGAs, - Network bridge for processors or FPGAs, - Standalone A5 class processor with multiple communications interfaces, - Redundant processor system for implementing additional system-level lower power modes, - Redundant processor system for implementing failsafe strategy<br /> <br />Based on our experience marketing ARM Cortex-M based microcontrollers to the space market, we have determined that is a demand for a device like the I/O Expander Chip for the types of applications that are stated in section 10.1. This device, implemented in CMOS and radiation-hardened by HARDSIL would be an ideal companion chip to next generation spaceflight processors as well as a cost-effective alternative to solutions such as some expensive FPGAs and SPARC-based products.","releaseStatus":"Released","status":"Completed","destinationType":["Earth"],"trlBegin":2,"trlCurrent":3,"trlEnd":3,"favorited":false,"detailedFunding":false,"programContacts":[],"endDateString":"Feb 2019","startDateString":"Jul 2018"},"relatedProjectId":102321,"relatedProject":{"projectId":102321,"title":"Radiation-Hardened I/O Expansion Chip","startDate":"2019-08-11","startYear":2019,"startMonth":8,"endDate":"2021-01-10","endYear":2021,"endMonth":1,"programId":73,"program":{"ableToSelect":false,"acronym":"SBIR/STTR","isActive":true,"description":"<p>The NASA SBIR and STTR programs fund the research, development, and demonstration of innovative technologies that fulfill NASA needs as described in the annual Solicitations and have significant potential for successful commercialization. If you are a small business concern (SBC) with 500 or fewer employees or a non-profit RI such as a university or a research laboratory with ties to an SBC, then NASA encourages you to learn more about the SBIR and STTR programs as a potential source of seed funding for the development of your innovations.</p><p><strong>The SBIR and STTR programs have 3 phases</strong>:</p><ul><li><strong>Phase I</strong> is the opportunity to establish the scientific, technical, and commercial feasibility of the proposed innovation in fulfillment of NASA needs.</li><li><strong>Phase II</strong> is focused on the development, demonstration and delivery of the proposed innovation.</li></ul><p>The SBIR and STTR Phase I contracts last for 6 months with a maximum funding of $125,000, and Phase II contracts last for 24 months with a maximum funding of $750,000 - $1.5 million.</p><ul><li><strong>Phase III</strong> is the commercialization of innovative technologies, products, and services resulting from either a Phase I or Phase II contract. Phase III contracts are funded from sources other than the SBIR and STTR programs and may be awarded without further competition.</li></ul><p><strong>Opportunity for Continued Technology Development Post-Phase II</strong>:</p><p>The NASA SBIR/STTR Program currently has in place two initiatives for supporting its small business partners past the basic Phase I and Phase II elements of the program that emphasize opportunities for commercialization. Specifically, the NASA SBIR/STTR Program has the Phase II Enhancement (Phase II-E) and Phase II eXpanded (Phase II-X) contract options.&nbsp;</p><p><strong>Please review the links below to obtain more information on the SBIR/STTR programs.</strong></p><ul><li><strong><a target=\"_blank\" href=\"http://sbir.gsfc.nasa.gov/sites/default/files/ParticipationGuide.pdf\">Participation Guide</a></strong></li></ul><p>Provides an overview of the SBIR and STTR programs as implemented by NASA</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/solicitations\">Program Solicitations</a></strong></li></ul><p>Provides access to the annual SBIR/STTR Solicitations containing detailed information on the program eligibility requirements, proposal instructions and research topics and subtopics</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/prg_sched_anncmnt\">Schedule and Awards</a></strong></li></ul><p>Schedule and links for the SBIR/STTR solicitations and selection announcements</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/content/additional-sources-assistance\">Sources of Assistance</a></strong></li></ul><p>Federal and non-Federal sources of assistance for small business</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/abstract_archives\">Awarded Abstracts</a></strong></li></ul><p>Search our complete archive of awarded project abstracts to learn about what NASA has funded</p><ul><li><strong><a href=\"http://sbir.gsfc.nasa.gov/content/frequently-asked-questions\">Frequently Asked Questions</a></strong></li></ul><p>&nbsp;Still have questions? 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We have gathered the best available knowledge of HPSC use-cases to conceptualize and articulate the requirements for an I/O Expansion Chip, creating an architecture for an optimized and robust IC that can be implemented to meet the requirements of next generation NASA space electronics systems. In addition to providing a perfect companion IC to the HPSC in next generation systems architectures, the I/O Expansion Chip can facilitate the use of the HPSC with legacy systems (such as those that include MIL-STD-1553 communications). Support of legacy systems is a practical requirement for the next decade. The I/O Expansion Chip will allow the HPSC to interface with legacy systems as well as next generation systems. We most recently added USB 3.0 to the definition to support camera interfaces that are being considered / selected for Orion and SPLICE programs at NASA Johnson Space Center. VORAGO Technologies would like to commercialize the I/O Expansion Chip product and target sales to NASA and non-NASA commercial aerospace customers. Making the product commercially successful outside of NASA applications will increase sales volume and establish a more robust supply chain for the product. In phase II, we propose to create a detailed IC specification, acquire the main IP blocks and create a hardware prototype system of the I/O Chip using the Synopsys HAPS80 prototyping system. This approach is consistent with that taken for the HPSC chiplet development process.","benefits":"The I/O Expansion Chip will be suitable for use in spacecraft, and cyber-physical/robotics or autonomous systems in space radiation environments. Everywhere that an HPSC device can be used, it is likely that one or more I/O Expansion Chips can be used. Such applications include: Vision-based algorithms with real-time requirements (e.g. landing with hazard avoidance), Model-based reasoning techniques for autonomy (e.g. Mars rover mission planning), High rate instrument data processing (e.g. high-resolution satellite image processing)<br /> <br />I/O Expansion for processors & FPGAs, Multi-comms interface & hub for processors & FPGAs, Network bridge for processors/FPGAs, Standalone A5 class processor with multiple comms interfaces, Redundant processor system for implementing system-level low power modes, Redundant processor system for implementing failsafe, Interface to cameras on Orion and SPLICE programs that use USB 3.0 camera interface","releaseStatus":"Released","status":"Completed","destinationType":["Earth"],"trlBegin":3,"trlCurrent":4,"trlEnd":4,"favorited":false,"detailedFunding":false,"programContacts":[],"endDateString":"Jan 2021","startDateString":"Aug 2019"},"technologyOutcomePartner":"Other","technologyOutcomeDate":"2019-08-11","technologyOutcomePath":"Advanced_To","infoText":"Advanced within the program","infoTextExtra":"Another project within the program (Radiation-Hardened I/O Expansion Chip)","isIndirect":true,"infusionPretty":"","isBiDirectional":true,"technologyOutcomeDateString":"Aug 2019","technologyOutcomeDateFullString":"August 2019","technologyOutcomePartnerPretty":"Other","technologyOutcomePathPretty":"Advanced To","technologyOutcomeRationalePretty":""}],"primaryImage":{"file":{"fileExtension":"jpg","fileId":370130,"presignedUpload":false,"fileSizeString":"0 Byte"},"libraryItemId":369725,"description":"Final Summary Chart Image","projectId":94726,"publishedDateString":"","entryDateString":"","libraryItemTypePretty":"","modifiedDateString":""},"libraryItems":[{"file":{"fileExtension":"pdf","fileId":370128,"fileName":"1521853077937","fileSize":113536,"objectId":369723,"objectType":"libraryItemFiles","presignedUpload":false,"fileSizeString":"110.9 KB"},"files":[{"fileExtension":"pdf","fileId":370128,"fileName":"1521853077937","fileSize":113536,"objectId":369723,"objectType":"libraryItemFiles","presignedUpload":false,"fileSizeString":"110.9 KB"}],"libraryItemId":369723,"title":"Briefing Chart","libraryItemType":"Document","projectId":94726,"internalOnly":false,"publishedDateString":"","entryDateString":"01/22/25 01:10 AM","libraryItemTypePretty":"Document","modifiedDateString":"01/08/24 08:27 PM"},{"file":{"fileExtension":"jpg","fileId":370129,"fileName":"1516639757580","fileSize":32225,"objectId":369724,"objectType":"libraryItemFiles","presignedUpload":false,"fileSizeString":"31.5 KB"},"files":[{"fileExtension":"jpg","fileId":370129,"fileName":"1516639757580","fileSize":32225,"objectId":369724,"objectType":"libraryItemFiles","presignedUpload":false,"fileSizeString":"31.5 KB"}],"libraryItemId":369724,"title":"Briefing Chart Image","description":"Briefing Chart Image","libraryItemType":"Image","projectId":94726,"isPrimary":false,"internalOnly":false,"publishedDateString":"","entryDateString":"01/22/25 01:10 AM","libraryItemTypePretty":"Image","modifiedDateString":"01/08/24 08:27 PM"},{"file":{"fileExtension":"jpg","fileId":370130,"fileName":"1546628618216","fileSize":618595,"objectId":369725,"objectType":"libraryItemFiles","presignedUpload":false,"fileSizeString":"604.1 KB"},"files":[{"fileExtension":"jpg","fileId":370130,"fileName":"1546628618216","fileSize":618595,"objectId":369725,"objectType":"libraryItemFiles","presignedUpload":false,"fileSizeString":"604.1 KB"}],"libraryItemId":369725,"title":"Final Summary Chart Image","description":"Final Summary Chart Image","libraryItemType":"Image","projectId":94726,"isPrimary":true,"internalOnly":false,"publishedDateString":"","entryDateString":"01/22/25 01:10 AM","libraryItemTypePretty":"Image","modifiedDateString":"01/08/24 08:27 PM"}],"states":[{"abbreviation":"CA","country":{"abbreviation":"US","countryId":236,"name":"United States"},"countryId":236,"name":"California","stateTerritoryId":59,"isTerritory":false},{"abbreviation":"TX","country":{"abbreviation":"US","countryId":236,"name":"United States"},"countryId":236,"name":"Texas","stateTerritoryId":29,"isTerritory":false}],"endDateString":"Feb 2019","startDateString":"Jul 2018"}}