Innovative projects are sought in the areas of basic research, fundamental research, applied research, development and systems and other concept formulation studies. Projects combining both science and technology are encouraged.
The JPL Director created the Research and Technology Development (R&TD) program for the purpose of enhancing JPL's ability to address future missions and objectives and to propel JPL into new research leadership roles. The program will support research in areas consistent with JPL's strategic direction and long-term vision.
","parentProgram":{"ableToSelect":false,"acronym":"IRAD","isActive":true,"programId":87,"responsibleMd":{"canUserEdit":false,"locationEdit":false,"organizationRolePretty":"","organizationTypePretty":""},"title":"Center Independent Research & Development","acronymOrTitle":"IRAD"},"parentProgramId":87,"programId":154,"responsibleMd":{"organizationId":4910,"organizationName":"Mission Support Directorate","acronym":"MSD","organizationType":"NASA_Mission_Directorate","canUserEdit":false,"locationEdit":false,"organizationRolePretty":"","organizationTypePretty":"NASA Mission Directorate"},"responsibleMdOffice":4910,"title":"Center Independent Research & Development: JPL IRAD","acronymOrTitle":"JPL IRAD"},"acronym":"MECSC","description":"Integration of a mix of heterogeneous electronic device technologies (silicon, III-V, passive, etc.) into a single multifunctional substrate core. Based on the development and implementation of 2.5D and 3-D interconnect and interposer packaging technologies. Target small sat deep space transponder/RF comms boards into one board for >50% size and weight savings.
A custom multifunctional core substrate scheme comprised of next generation polyimide, ceramic and/or silicon materials will be designed to integrate new 2.5D and 3-D interconnect technologies into producing a significant size and power reduced RF transponder. Development of heterogeneous flip chip attachment to low loss substrates, embedded RF waveguides and passives (R,L,C) and completely plug in/stackable Multichip Modules (MCM) will be required to meet this goal.
","benefits":"Substantially reduce the size of RF systems such as radio and communication boards and demonstrate the cost effectiveness of 2.5D packaging technology into low volume production.
","releaseStatus":"Released","status":"Completed","viewCount":759,"destinationType":[],"trlBegin":3,"trlCurrent":3,"trlEnd":5,"lastUpdated":"04/24/25","favorited":false,"detailedFunding":false,"projectContacts":[{"contactId":238165,"canUserEdit":false,"firstName":"Jonas","lastName":"Zmuidzinas","fullName":"Jonas Zmuidzinas","fullNameInverted":"Zmuidzinas, Jonas","email":"jonas.zmuidzinas@jpl.nasa.gov","receiveEmail":"Subscribed_User","projectContactRole":"Project_Manager","projectContactId":6031,"projectId":16825,"programContactRolePretty":"","projectContactRolePretty":"Project Manager"},{"contactId":125858,"canUserEdit":false,"firstName":"Donald","lastName":"Schatzel","fullName":"Donald V Schatzel","fullNameInverted":"Schatzel, Donald V","middleInitial":"V","email":"donald.v.schatzel@jpl.nasa.gov","receiveEmail":"Subscribed_User","projectContactRole":"Principal_Investigator","projectContactId":43654,"projectId":16825,"programContactRolePretty":"","projectContactRolePretty":"Principal Investigator"}],"programContacts":[{"contactId":155484,"canUserEdit":false,"firstName":"Fred","lastName":"Hadaegh","fullName":"Fred Y Hadaegh","fullNameInverted":"Hadaegh, Fred Y","middleInitial":"Y","email":"fred.y.hadaegh@jpl.nasa.gov","receiveEmail":"Subscribed_User","programContactRole":"Program_Manager","programContactId":97,"programId":154,"programContactRolePretty":"Program Manager","projectContactRolePretty":""}],"leadOrganization":{"organizationId":4946,"organizationName":"Jet Propulsion Laboratory","acronym":"JPL","organizationType":"FFRDC_2fUARC","city":"Pasadena","stateTerritoryId":59,"stateTerritory":{"abbreviation":"CA","country":{"abbreviation":"US","countryId":236,"name":"United States"},"countryId":236,"name":"California","stateTerritoryId":59,"isTerritory":false},"country":{"abbreviation":"US","countryId":236,"name":"United States"},"countryId":236,"zipCode":"91109","projectId":16825,"projectOrganizationId":34980,"organizationRole":"Lead_Organization","canUserEdit":false,"locationEdit":false,"organizationRolePretty":"Lead Organization","organizationTypePretty":"FFRDC/UARC"},"otherOrganizations":[{"organizationId":4946,"organizationName":"Jet Propulsion Laboratory","acronym":"JPL","organizationType":"FFRDC_2fUARC","city":"Pasadena","stateTerritoryId":59,"stateTerritory":{"abbreviation":"CA","country":{"abbreviation":"US","countryId":236,"name":"United States"},"countryId":236,"name":"California","stateTerritoryId":59,"isTerritory":false},"country":{"abbreviation":"US","countryId":236,"name":"United States"},"countryId":236,"zipCode":"91109","projectId":16825,"projectOrganizationId":34980,"organizationRole":"Lead_Organization","canUserEdit":false,"locationEdit":false,"organizationRolePretty":"Lead Organization","organizationTypePretty":"FFRDC/UARC"}],"primaryTx":{"taxonomyNodeId":11218,"taxonomyRootId":8817,"parentNodeId":11216,"code":"TX08.1.2","title":"Electronics","description":"Electronics include analog and mixed-signal instrument electronics and associated packaging technology that are designed for reuse and/or extensibility and that have reduced volume, mass, and power that can operate over a wide temperature range and other extreme environments, such as high radiation. This area includes detector support electronics such as digital back ends; high-voltage power supplies; wireless networking techniques; and integrated electronic, photonic, and sensor readouts that enable significant signal processing and data compression.","exampleTechnologies":"Analog and mixed-signal instrument front end electronics application-specific integrated circuits (ASICs), Field Programmable Gate Arrays (FPGAs) and discrete components (e.g., radio frequency (RF) System on Chip, Multi-Channel Digitizer (MCD); control and bias voltage electronics; low noise amplifiers; multi-channel A/D and D/A Converters; trans-impedance amplifiers and bias generators), space cube, onboard Synthetic Aperture Radar (SAR) processor, Modular Unified Space Technology Avionics for Next Generation missions (MUSTANG), nanoelectronics","level":3,"hasChildren":false,"selected":false,"isPrimary":true,"hasInteriorContent":true},"primaryTxTree":[[{"taxonomyNodeId":11215,"taxonomyRootId":8817,"code":"TX08","title":"Sensors and Instruments","level":1,"hasChildren":true,"selected":false,"hasInteriorContent":true},{"taxonomyNodeId":11216,"taxonomyRootId":8817,"parentNodeId":11215,"code":"TX08.1","title":"Remote Sensing Instruments and Sensors","description":"Remote sensing instruments and sensors include components, sensors, and instruments that are sensitive to electromagnetic radiation; particles (charged, neutral, dust); electromagnetic fields, both direct current (DC) and alternating current (AC); acoustic energy; seismic energy; and whatever physical phenomenology the science requires. These instruments and sensors can be active or passive devices, depending on the measurement regime and detection technology.","level":2,"hasChildren":true,"selected":false,"hasInteriorContent":true},{"taxonomyNodeId":11218,"taxonomyRootId":8817,"parentNodeId":11216,"code":"TX08.1.2","title":"Electronics","description":"Electronics include analog and mixed-signal instrument electronics and associated packaging technology that are designed for reuse and/or extensibility and that have reduced volume, mass, and power that can operate over a wide temperature range and other extreme environments, such as high radiation. This area includes detector support electronics such as digital back ends; high-voltage power supplies; wireless networking techniques; and integrated electronic, photonic, and sensor readouts that enable significant signal processing and data compression.","exampleTechnologies":"Analog and mixed-signal instrument front end electronics application-specific integrated circuits (ASICs), Field Programmable Gate Arrays (FPGAs) and discrete components (e.g., radio frequency (RF) System on Chip, Multi-Channel Digitizer (MCD); control and bias voltage electronics; low noise amplifiers; multi-channel A/D and D/A Converters; trans-impedance amplifiers and bias generators), space cube, onboard Synthetic Aperture Radar (SAR) processor, Modular Unified Space Technology Avionics for Next Generation missions (MUSTANG), nanoelectronics","level":3,"hasChildren":false,"selected":true,"hasInteriorContent":true}]],"technologyOutcomes":[],"libraryItems":[],"states":[{"abbreviation":"CA","country":{"abbreviation":"US","countryId":236,"name":"United States"},"countryId":236,"name":"California","stateTerritoryId":59,"isTerritory":false}],"endDateString":"Oct 2017","startDateString":"Oct 2013"}}